MediaTek Dimensity 7050 6nm Chip launched with up to 200MP camera, HyperEngine 3.0; power on Lava Agni 2 5G

MediaTek has launched another 7000 series chipset the Dimensity 7050, which has similar specifications as the Dimensity 1080. It features 6nm-class technology that enables enhanced power efficiency when combined with MediaTek 5G UltraSave to provide long-lasting performance.

It has an Octa-Core CPU with 2 Arm Cortex-A78 performance cores that can run at up to 2.6GHz and 6 Arm Cortex-A55 efficiency cores that can run at 2.0GHz and a Mali-G68 graphics engine. It supports 200MP main cameras, a plethora of hardware-based camera engines, and a specialized 4K HDR video capture engine while consuming little battery power. Furthermore, the MediaTek APU 550 enables a number of AI camera enhancements.

It boasts HyperEngine technology, which provides integrated 5G HSR mode, in which the smartphone actively searches for and connects to the lowest latency accessible cell tower to reduce online ping. The chipset uses Intelligent Refresh Rate Display technology to enable full HD+ displays up to 120Hz. It offers Wi-Fi 6 with 2×2 MIMO, Bluetooth 5.2, and GNSS, and faster 5G Carrier Aggregation (2CC-CA) with mixed duplex FDD+TDD that uses low and mid-band for higher speeds, greater reach, and a seamless handover. 

MediaTek Dimensity 7050 Specifications -

Availability -

The MediaTek Dimensity 7050 will be the first power-on Lava Agni 2 5G smartphone, which will be released in India soon. It is expected to power 5G devices that will be released in the global market this Q2, 2023.