MediaTek Dimensity 7450 and Dimensity 7450X launched with 3GPP R17 5G, Up to 7% AI Boost, 144Hz Display Support
MediaTek has launched its latest chips in the 7000 series lineup, the MediaTek Dimensity 7450 for the Global Market, and the successor to the MediaTek Dimensity 7400 introduced last year. As before, the company has also announced the MediaTek Dimensity 7450X, a variant tailored for flip-style foldable smartphones with dual-display support.
Both chipsets feature an octa-core architecture comprising four Arm Cortex-A78 cores clocked up to 2.6GHz and four Cortex-A55 cores, retaining the same CPU configuration as their predecessor. However, MediaTek claims up to a 7% improvement in AI performance, particularly enhancing tasks like computational photography. The new chips also upgrade to a 5G Release 17 modem, replacing the Release 16 modem found in the previous generation.
5G Connectivity and Networking -
The Dimensity 7450 series integrates a 5G modem compliant with the global 3GPP Release 17 standard. It supports both Standalone (SA) and Non-Standalone (NSA) modes, Sub-6GHz 5G, and mixed FDD/TDD duplexing.
For speeds, the chipset leverages 3CC carrier aggregation across up to 140MHz of spectrum, enabling peak downlink speeds of up to 3.27Gbps. Power efficiency is improved with MediaTek’s 5G UltraSave 3.0+ technology, which is designed to deliver up to 20% better efficiency in typical Sub-6GHz scenarios
Additional enhancements include a second-generation high-speed rail mode that boosts connectivity performance by up to 20% during transit, along with faster network recovery when moving out of low-signal areas.
On the local connectivity front, the SoC supports tri-band Wi-Fi 6E with a 2T2R antenna configuration and Bluetooth 5.4. It also incorporates MediaTek’s Network Observation System (NOS), which intelligently predicts network conditions to enable seamless switching between 5G and Wi-Fi networks.
MediaTek Dimensity 7450 and Dimensity 7450X Specifications -
| CPU Architecture | Octa-core (8): 4x Arm Cortex-A78 (up to 2.6GHz) + 4x Arm Cortex-A55 |
| GPU | Arm Mali-G615 MC2 |
| Manufacturing Process | 4nm-class |
| Memory Support | LPDDR5 / LPDDR4x (Up to 6400Mbps) |
| Storage Support | UFS 3.1 / UFS 2.2 |
| Cellular Modem | 3GPP R17 5G Modem (SA/NSA, Sub-6GHz) |
| Peak 5G Downlink | Up to 3.27Gbps (3CC Carrier Aggregation, 140MHz bandwidth) |
| Local Connectivity | Wi-Fi 6E (a/b/g/n/ac/ax), 2T2R antenna, Bluetooth 5.4 |
| Location Services | GPS, BeiDou, Glonass, Galileo, QZSS, NavIC |
| Max Camera Sensor | 200MP (Imagiq 950 ISP, 12-bit HDR) |
| Max Video Capture | 4K @ 30fps (3840 x 2160), 4K Video HDR, Video EIS |
| Max Display Support | WFHD+ @ 120Hz or Full HD+ @ 144Hz |
| AI Processor | MediaTek 6th-generation NPU |
Smartphones powered by the MediaTek Dimensity 7450 and MediaTek Dimensity 7450X are expected to arrive in the market over the next few months.
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