TECNO Showcase 4.9mm Ultra-Thin Modular Magnetic Smartphone Concept ahead of MWC 2026
TECNO is set to introduce a new smartphone concept built around its Modular Magnetic Interconnection Technology at the 2026 Mobile World Congress (MWC). The TECNO Modular Phone leverages magnetic attachments and wireless communication to let users physically enhance and expand the device’s hardware capabilities.
The concept aims to address the growing processing demands of artificial intelligence while working within the size limitations of conventional smartphones.
Design and Build -
The TECNO Modular Phone features an ultra-slim base unit measuring just 4.9mm thick. It combines a polished metal frame with a glass rear panel finished in a laminated anti-glare coating, resulting in a refined matte texture.
On the back, eight subtly defined modular zones visually segment the surface. These markings act as alignment guides, helping users accurately position and attach accessories. TECNO has unveiled two distinct design versions of the concept:
- ATOM Edition - Showcases a silver aluminum chassis accented with red highlights, emphasizing a clean and structured design language.
- MODA Edition - Adopts a more expressive and dynamic aesthetic aimed at tech enthusiasts seeking a bold look.
Modular Ecosystem -
The platform is built around a suite of interchangeable hardware modules, with approximately ten modules planned for the ecosystem’s initial phase.
Some of the primary modules include:
- Power Bank - An ultra-slim 4.5mm battery module that effectively doubles the phone’s power capacity. Even when attached to the 4.9mm base device, the overall thickness remains comparable to that of typical non-modular smartphones.
- Action Camera - Designed to enable creative shooting angles and alternative workflows without significantly adding bulk or weight.
- Telephoto Lens - A standalone camera module that integrates with the phone, using the smartphone’s display as a low-latency viewfinder for real-time previews and image capture.
Connectivity Framework -
The attachment and communication system relies on a hybrid architecture that handles both physical mounting and data exchange.
- Physical Attachment and Power Delivery - A rectangular magnetic array secures modules to the device, while pogo-pin connectors supply power efficiently and help minimize heat generation.
- Data Transfer - The system intelligently manages data transmission using Wi-Fi, Bluetooth, and millimeter-wave (mmWave) technologies, optimizing bandwidth and latency according to each module’s performance needs.
Scalability and Future Potential -
TECNO positions the Modular Phone as an experimental platform designed to evaluate the long-term feasibility of adaptable hardware ecosystems. Although the current implementation is proprietary, the underlying physical and connectivity framework is engineered to support future expansion.
The company suggests that upcoming modules could include expanded storage solutions, dedicated AI processing units, and lifestyle-focused accessories. Over time, the ecosystem may also evolve toward broader compatibility beyond TECNO’s core product lineup.
Commenting on the concept device, Leo Li, Product Head of Modular Magnetic Interconnection Technology at TECNO, stated:
He emphasized that technology should not be viewed as a static, finished product, but as a tool that expands human freedom. According to him, the modular architecture is designed to move beyond the limitations of fixed hardware, placing greater control and customization in the hands of users.
He described the innovation as more than just an advancement in connectivity, calling it a step toward “mobile liberation” — where a device is shaped not by its original factory configuration, but by the user’s needs and intentions at any given moment.
