MediaTek Dimensity 7400 and Dimensity 7400X Chipsets Launched with Enhanced Performance and Efficiency along with Dimensity 6400 SoC
MediaTek has launched its latest addition to its 7000 series, the Dimensity 7400, succeeding last year’s Dimensity 7300. As with the previous generation, the company has also introduced the Dimensity 7400X, designed specifically for flip-style foldable devices with support for dual displays.
Both octa-core chipsets feature 4x Arm Cortex-A78 cores clocked at up to 2.6GHz, paired with 4x Arm Cortex-A55 cores. While the performance cores see a slight clock speed increase, the overall specifications remain largely unchanged.
According to MediaTek, these chipsets, builton TSMC’s 4nm process, tonsume 14% to 36% less power during gaming cthan rival offerings They retain the company’s NPU 6.0 but boast a 15% performance improvement over the Dimensity 7300.
Additional features include the Imagiq 950 ISP, a 5G R16 modem with 3CC carrier aggregation (3CC-CA), and Tri-band Wi-Fi 6E support.
Dimensity 7400 / 7400X SoC Features -
| CPU | 4x Cortex-A78 @ 2.6GHz, 4x Cortex-A55 @ 2GHz |
| Process | TSMC 4nm-class |
| RAM/Storage | LPDDR5 / LPDDR4x up to 6400Mbps, UFS 2.2, UFS 3.1 |
| GPU/APU | Arm Mali-G615 MC2 / MediaTek 6th generation APU 655 |
| Video | H.264, HEVC, VP-9 |
| Camera | Imagiq 950 ISP, 12-bit HDR-ISP, Hardware Face Detection Hardware MCNR 4K Video HDR AI-3A with AE, AWB, AF Video EIS Dual simultaneous video capture All-pixel AF |
| Display | WFHD+ @ 120Hz Full HD+ @ 144Hz, Dual display support (7400X) |
| Network | 2G-5G Multi-Mode, 5G/4G CA, 5G/4G FDD / TDD, CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, GSM, TD-SCDMA, WCDMA SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD and FDD bands, DSS, NR DL 3CC 140MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, R16 UL Enhancement, 2×2 MIMO, 256QAM VoNR / EPS fallback |
| Connectivity | Integrated Wi-Fi 6E (a/b/g/n/ac/ax) 2T2R, Bluetooth 5.4, GPS BeiDou Glonass Galileo QZSS NavIC |
Dimensity 6400 -
MediaTek has also introduced the Dimensity 6400, featuring an octa-core CPU with 2x Arm Cortex-A76 cores clocked at up to 2.5GHz and 6x Arm Cortex-A55 cores running at up to 2.0GHz. Compared to the Dimensity 6300, this chipset offers a slight boost in performance core speeds.
Still based on TSMC’s 6nm process, the Dimensity 6400 is said to deliver 19% lower power consumption during gaming than competing chipsets.
It also incorporates MediaTek’s Bluetooth Wi-Fi HyperCoex Technology, which reduces gaming latency by up to 90% for a smoother experience. Additionally, the chipset supports billion-color displays with true 10-bit image and video processing, enhanced by True Color Accuracy for more precise and lifelike visuals.
Dimensity 6400 SoC Features -
| CPU | 2x Cortex-A76 @ 2.5GHz 6x Cortex-A55 @ 2GHz |
| Process | TSMC N6 (6nm-class) |
| RAM/Storage | LPDDR4x 2133MHz, UFS 2.2 (2-lane) |
| GPU | Arm Mali-G57 MC2 |
| Video | 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps |
| Camera | 16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD |
| Display | 2520 x 1080 (Full HD+) at 21:9 up to 120Hz + 3D LUT |
| Network | 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA Global SA & NSA; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 140 MHz bandwidth, 256QAM NR UL 2CC, 256QAM VoNR, Dual VoNR, Dual 5G SIM, EPS fallback |
| Connectivity | Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC |
Availability -
MediaTek has confirmed that the first smartphones featuring the Dimensity 7400 and 7400X will launch in Q1 2025. Meanwhile, the Dimensity 6400 debuted in the realme P3x 5G, which was released in India earlier this month.
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