MediaTek Dimensity 9500 3nm Next-Gen Flagship SoC launched with All-New C1-Ultra Core

MediaTek has officially announced the Dimensity 9500, its latest flagship SoC and the successor to the Dimensity 9400/9400+. Built on TSMC’s third-generation 3nm process, the chip features a third-generation all-large-core CPU architecture.

The Dimensity 9500 introduces an all-new C1-Ultra core, delivering a 10% increase in IPC over the previous generation, alongside C1-Premium and C1-Pro cores. The CPU configuration includes a 4.21GHz C1 Ultra core, three 3.5GHz C1 Premium cores, and four C1 Pro performance cores, paired with four-lane UFS 4.1 storage.

CPU -

According to MediaTek, this design offers up to 32% higher single-core performance and 17% higher multi-core performance compared to its predecessor, while the ultra core achieves up to 55% lower power consumption at peak performance, improving battery life and overall efficiency. The Dimensity 9500 is also up to 30% more power-efficient during multitasking in games and social audio applications.

The platform features a new cache and memory architecture and becomes the first in the industry to support 4-channel UFS 4.1, which doubles read/write speeds and accelerates large AI model loading by 40%. The second-generation Dimensity Scheduling Engine ensures smooth responsiveness and sustained efficiency, even under heavy workloads.

GPU -

On the graphics side, the Dimensity 9500 integrates the new Arm G1-Ultra GPU, offering up to 33% higher peak performance and 42% improved power efficiency, with frame rate interpolation up to 120FPS for ray tracing. MediaTek also highlighted collaborations with leading studios, supporting MegaLights in Unreal Engine 5.6 and Nanite in Unreal Engine 5.5, enabling AAA-level real-time rendering and immersive lighting effects.

NPU -

The Dimensity 9500 features the ninth-generation MediaTek NPU 990 with Generative AI Engine 2.0, which doubles computing power and introduces BitNet 1.58-bit large model processing, reducing power consumption by up to 33%. By doubling both integer and floating-point computing capabilities, the chip delivers 100% faster output for 3-billion-parameter LLMs, supports 128K-token long text processing, and enables the industry’s first 4K ultra-high-definition image generation, all while cutting peak power consumption by 56%.

The Dimensity 9500 is also the first to incorporate an integrated compute-in-memory architecture for its new Super Efficient NPU, dramatically reducing energy use and allowing AI models to run continuously. This advancement enables more sophisticated, proactive AI experiences for users.

ISP -

Equipped with MediaTek Imagiq 1190, the Dimensity 9500 supports RAW-domain pre-processing, captures up to 200MP images, offers 30fps continuous focus tracking, and introduces a new portrait engine capable of cinematic 4K 60FPS portrait video. The platform also delivers Android’s first 4K120 Dolby Vision video capture with EIS.

It's MiraVision Adaptive Display technology dynamically adjusts contrast and color saturation based on ambient light, panel characteristics, and real-time content analysis. This ensures clear and comfortable viewing both outdoors in bright conditions—without overheating during extended use—and indoors in very dark environments, providing eye protection without compromising clarity.

Connectivity -

The Dimensity 9500’s connectivity suite includes enhanced Bluetooth calls, fast Wi-Fi transfer, and multi-network intelligence for seamless calls and data. AI-powered communication features reduce power consumption by up to 10% in 5G and 20% in Wi-Fi scenarios, while 5CC carrier aggregation boosts bandwidth by 15%. Advanced AI-driven positioning and network selection improve accuracy by 20% and lower network latency by 50% through congestion prediction.

MediaTek Dimensity 9500 Specifications -

Availability -

The vivo X300 series, set to launch in China on October 13th, will be among the first smartphones to feature the Dimensity 9500 flagship chip. The series will also include the V3+ imaging chip, promising enhanced performance, improved energy efficiency, and more advanced image fusion capabilities.

Similarly, OPPO has confirmed that its Find X9 series, launching on October 16th, will also be powered by the Dimensity 9500 flagship chip.