Samsung Exynos 2600 2nm SoC May Feature Integrated Heat Pass Block for Improved Thermal Efficiency
Samsung Electronics is working on a next-generation packaging technology for its upcoming mobile application processor (AP), the Exynos 2600, according to a ZDNET Korea press report. This innovation is expected to integrate heat-dissipating components directly within the chip package, potentially enhancing the thermal efficiency and performance of the Galaxy S26 series, slated for release next year.
The company is reportedly developing a Heat Pass Block (HPB) for the Exynos 2600 as part of its ongoing R&D efforts.
Built on Samsung’s in-house 2-nanometer (2nm) process, the Exynos 2600 is a system-on-chip (SoC) that combines the CPU, GPU, and NPU into a single unit. It is expected to power the upcoming Galaxy S26 flagship lineup, which, like its predecessor, may feature either Exynos or Snapdragon chips depending on the region.
The HPB, a copper-based heatsink, marks a departure from the traditional package-on-package (PoP) structure used in earlier Exynos processors, where DRAM was stacked on top of the AP. Instead, the new design places the DRAM and the HPB side-by-side within the same package. This layout is aimed at improving heat absorption and overall thermal management of the chip.
Samsung is targeting October to complete quality validation of the Exynos 2600 with the integrated HPB. If successful, mass production could begin promptly to ensure readiness for the Galaxy S26 launch.
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